The ZU19-C1760 a set of 3 BGA adaptors that, when combined with a LoadSlammer, will provide a fast and comprehensive method for testing and validating the Power Delivery Solution specifically for the Xilinx Ultrascale+ ZU19-C1760
Features
- Set of 3 Passive Adaptors (PA) for PDN testing AMD Xilinx Zynq UltraScale+ ZU19-C1760 series FPGAs
- 5 Samtec connectors to slam: VCCINT, MGTAVCC, VCCAUX, VCCINT_IO, MGTAVTT.
- 6 SMP connectors for testing: MGTAVTT, VCCINT, MGTAVCC, VCCAUX, VCCINT_IO, GND.
- PA with BGA footprint reflows onto ZU19-C1760 PCB pads.
- Remote Vsense on Samtec connectors and SMP mini connectors.
- Most rails can be tested with an LSP200 controller.
- GUI supports transient, pulse train, impedance and 3D plots